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Microvias : for low-cost, high-density interconnects /
by Lau, John H. Published 2001
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    3D IC integration and packaging /
    by Lau, John H. Published 2016
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      Through-Silicon Vias for 3D Integration /
      by Lau, John H. Published 2013
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        Reliability of RoHS-Compliant 2D and 3D IC interconnects /
        by Lau, John H. Published 2011
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          KMUTT (4)
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          mai (4)
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          EBOOKS (4)
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          T - Technology (4)
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          Lau, John H. Selected
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          English (4)
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